Thin film deposition technology is an essential technology widely used in the current production processes of semiconductor, electronic device and various industrial components.
Ion Technology Center provides thin film deposition technologies by vacuum evaporation method, sputtering, CVD, PVD etc. for specific needs of client's. We will respond client's requests for not only solution to the research and development, but contract production as a subset of total production processes.
Service
Solutions to the problems in the manufacturing industries including improvement of precision and durability of mould, ion implantation assisted thin film deposition, evaluation of formed thin film etc. will be provided.
Wide field sizes of 2 to 12 inch wafers can be handled to achieve thin film deposition.
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The best technology matching will be provided with research of unique technology and evaluation expertise on demand for the solution.
Technology
Major Thin Film Deposition
Vacuum Evaporation
One of PVDs (Physical Vapor Deposition) that evaporates the target materials in vacuum, and deposits thin films of the target materials on the substrate
Sputtering
A process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles, that is used for thin film deposition, etching and analytical techniques.
Chemical Vapor Deposition
Volatile precursors which react and/or decompose on the substrate surface to be activated by hot filament, plasma, laser etc. and produce the desired deposit of thin film.
Physical Vapor Deposition
Purely physical processes such as high temperature vacuum evaporation or plasma sputter bombardment are used to vaporize the target material and deposit thin films by the condensation of the material onto various surfaces.
Ion Based Thin Film Deposition Technology
High Voltage Pulse and RF Superposition Technology
Gradient structure that is formed by Ion implantation into the substrate will enhance the adhesion of the thin film.
Plasma that covers the whole surfaces of the object substrate will form thin films on the whole areas with uniformity.
High Voltage Short Pulse Generation Technology
Uniform films deposition on uneven surfaces and controlled heating of substrate can be achieved.
Plasma Based Ion Implantation/Deposition Technology
Surface treatment of the target object with complex configuration is possible.
Enhancement of adhesion by surface treatment is possible.
Equipment
Ion Beam Sputtering (IBS)
Unbalanced Magnetron Sputtering (UBMS)